SG-BGA-6133 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

20.225mm
A
Top View
1
Assembled
8.25mm +
IC thickness
Side View
(Section AA)
10
20.225
6
Customer's
BGA IC
4
3
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 2 in lbs.
9
4
Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.75mm.
2
8
7
7 Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
11
Customer's Target PCB
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4
Thickness = 1.59mm
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
SG-BGA-6133 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H.Hansen
File: SG-BGA-6133 Dwg
Scale: -
Rev: C
Date: 10/13/04
Modified: 7/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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