SG-BGA-6127 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
(without fan)
40.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
A
A
1 ^{Fan: 20mm thick, 40mm square, 12V, 9.5 CFM}
Socket base: Black anodized 6061 Aluminum.
2 _{Thickness = 5mm.}
40.225mm
13
1
Side View
3
(Section AA)
3 Heat Sink Lid: Black anodized 6061 Aluminum.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Ultem 1000
Thickness = 0.75mm.
7 ^{Ball Guide: Kapton polyimide.}
Assembled
17.35mm
12
9
2
8
7
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread}
Socket lid screw: Socket head cap, Alloy steel with
9 _{black oxide finsih, 0-80 fine thread}
10 Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized aluminum.
Thickness = 6.35mm.
Thermal Pad: Bergquist Gap Pad 1500
12 _{Thickness = 1mm.}
10
6
Customer's
11
BGA IC
5
Customer's Target PCB
13
SG-BGA-6127 Drawing
Status: Released
Scale: -
Rev: C
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: H. Hansen
File: SG-BGA-6127 Dwg
Date: 8/3/04
Modified: 05/09/07
Phillips pan head M4 25mm length 18-8 SS.
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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