SG-BGA-6123 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
46.99mm
A
Side View
(Section AA)
46.99mm
1
11.2mm
Max Height
8
3
BGA IC
6
SG-BGA-6123 Drawing
© 2003 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
A
2
Socket ba se : Black a nodized 606 1 A luminum.
Thickn ess = 5mm.
Compression Plate: B lack ano dize d 6 061 Alu min um.
3 _{Thickn ess = 2.5mm.}
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Recommended torque = 10 in lbs.
Ela stomer: 4 0 micron dia go ld plated brass
5
filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
Ela stomer Guid e: Cirlex o r e quiva lent.
6 _{Thickn ess = 0.745mm.}
Bal l Gu ide: K apton polyimide.
4
7 _{Thickn ess = 0.25mm.}
9
Socket ba se screw: Socket hea d cap , Alloy steel with
8 _{bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .}
2
7
5
Target PCB
Socket lid screw: Socket hea d cap , Alloy steel with
9 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
Backing Plate: B lack ano dize d 6061 Alu min um.
10 ^{Thickn ess = 6.35mm.}
11
10
11 ^{Insulation Plate: FR4/G10, Th ickness = 1 .59 mm.}
Status: Released
Drawing: H. Hansen
File: SG-BGA-6123 Dwg
Scale: N/A
Rev: A
Date: 8/3/04
Modified:
PAGE 1 of 5
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.