SG-BGA-6120 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
28.225mm
A
Side View
1
(Section AA)
Assembled
8.25mm +
IC thickness
12
28.225mm
4
3
10
6
5
Customer's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Recommended torque = 6 in lbs./
96 in oz.
Elastomer: 40 micron dia gold plated brass
5 _{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
9
2
8
7
11
Customer's Target PCB
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 ^{Thickness = 6.35mm.}
12 IC frame: FR4.
SG-BGA-6120 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6120 Dwg
Scale: -
Rev: C
Date: 5/19/04
Modified: 7/6/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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