SG-BGA-6119 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
50mm sqr.
Side View
(Section AA)
4
1
36.2mm
3
6
5
Cust om er's
BGA IC
SG-BGA-6119 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
2
Socket ba se : Black a nodized 606 1 A luminum.
Thickn ess = 7.5mm.
3
Compression Plate: B lack ano dize d 6 061 Alu min um.
Thickn ess = 4.0mm.
Recommended torque = 32.5 in/lbs.
12
9
2
8
7
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 10mm, Hex socket = 5mm.
Ela stomer: 4 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
6
Ela stomer Guid e: Cirlex o r e quiva lent.
Thickn ess = 0.75mm.
7 ^{Bal l Gu ide: K apton polyimide.}
8
Socket ba se screw: Socket hea d cap , Alloy steel with
bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .
9
Socket lid screw: Socket hea d cap , Alloy steel with
bla ck o xid e finish, 0-80 fine th read , 4.76mm long.
10 ^{Insulation Plate: FR4 /G1 0, 1.59mm th ick.}
11 Backing Plate: A nodized 60 61Alu min um 6 .35 mm thick.
12
10
Customer's Target PCB
11
Status: Released
Scale: -
Rev: B
Drawing: Heidi Hansen
File: S G-BGA -6119 Dwg
Date: 11/11/04
Modified: 3/1/05
Fan: 5 0mm square , 10mm thi ck, 10 CFM air flow, 12V
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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