SG-BGA-6109 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
60 mm
A
7
22.42mm
Max Height
6
BGA IC
Side View
4
(Section AA)
SG-BGA-6109 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
1
Torque = 0.4 to 1 in-lbs
Heatsink Lid: Black anodized Aluminum.
1 ^{Thickness = 16mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Elastomer: 40 micron dia gold plated brass
3 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
4 _{Thickness = 0.725mm.}
Ball Guide: Kapton polyimide.
5 _{Thickness = 0.25mm.}
6
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
7 _thread.
Backing Plate: Black anodized Aluminum.
8 _{Thickness = 6.35mm.}
9 _{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
2
3
5
Target PCB
9
8
Status: Released
Drawing: H. Hansen
File: SG-BGA-6109 Dwg
Scale: 1:0.7
Rev: B
Date: 4/9/04
Modified: 5/19/09
PAGE 1 of 5
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.