SG-BGA-6099 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
48.03mm
A
Side View
(Section AA)
7
6
2
4
3
57.55mm
Cust om er's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
1
5
Customer's Target PCB
1
Heatsi nk Lid : Black an odized 606 1 A luminum.
Thickn ess = 16mm.
Socket ba se : Black a nodized 606 1 A luminum.
2 _{Thickn ess = 6.5mm.}
Ela stomer: 4 0 micron dia go ld plated brass
3 ^{filaments ar ranged symmetrically in a silicone}
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
4 Ela stomer Guid e: Cirlex o r e quiva lent.
Thickn ess = 0.75mm.
Bal l Gu ide: K apton polyimide.
5 _{Thickn ess = 0.25mm.}
Socket ba se screw: 4-40 Threa d, 1/2" lon g
6
7
Socket lid screw: 4-40 Threa d, 5/16" lo ng
Backing Plate: B lack ano dize d 6061 Alu min um.
8 _{Thickn ess = 25.40mm}
8
SG-BGA-6099 Drawing
© 2003 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: S G-BGA -6099 Dwg.mcd
Scale: 1:0.7
Rev: B
Date: 11/26/03
Modified: 8/30/04
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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