SG-BGA-6096 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
36.225mm
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
36.225mm
1
4
3
6
Customer's
5
11 _{BGA IC}
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 14 in lbs.
9
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent
6 _{Thickness = 0.725mm.}
2
8
7
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Customer's Target PCB
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Black anodized Aluminum}
Thickness = 6.35mm.
SG-BGA-6096 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Heidi Hansen
File: SG-BGA-6096 Dwg.mcd
Scale: -
Rev: B
Date: 11/26/03
Modified: 7/21/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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