SG-BGA-6094 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
32.23mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 6.5mm.
A
A
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 3.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Side View
(Section AA)
1
Assembled
9.30mm +
IC thickness
10
6
32.23mm
4
3
Customer's ⁵
BGA IC
Recommended torque = 5 in lbs.
9
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
2
8
7
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 4-40 thread , 9.5mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread
10
Insulation plate: Kapton polyimide film.
Thickness = 0.25mm.
Backing Plate: Black anodized 6061 Aluminum.
11 _{Thickness = 4mm.}
11
Customer's Target PCB
SG-BGA-6094 Drawing
© 2003 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6094 Dwg.mcd
Scale: -
Rev: B
Date: 12/19/03
Modified: 3/5/15
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4