SG-BGA-6084 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
42.725mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
1
Assembled
8.25mm +
IC thickness
42.725mm
4
3
Recommended torque = 15 in lbs./
240 in oz.
9
2
8
7
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Side View
(Section AA)
10
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
6
5
11 _Customer's
Customer's Target PCB
BGA IC
SG-BGA-6084 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6084 Dwg
Scale: -
Rev: E
Date: 7/28/03
Modified: 11/3/09, MAF
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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