SG-BGA-6074 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
(without heatsink)
Bottom View
GHz BGA Socket - Direct mount, solderless
Holes tapped in backing plate
for mounting socket base (x4).
63.245mm
Side View
36.046mm
63.245mm
42.5mm
2mm
4.75mm
Side View
(exploded)
24mm
Customer's BGA
9
3
1.91mm
Heat Sink Lid: Anodized 6061 Aluminum.
1 ^{Single piece construction. Bottom of heat sink has}
precision depth recess for die/capacitors.
Socket base: Black anodized 6061 Aluminum.
2 _{Thickness = 5mm.}
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
3 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
4 _{Thickness = 0.75mm.}
5 ^{Ball Guide: Kapton polyimide or equivalent.}
Socket base screw: Phillips pan head machine
1
6 ^{screw,18-8 stainless steel, 6-32 coarse thread ,}
9.525mm long.
Heat sink lid screw: Socket head cap, alloy steel with
7
7 _{black oxide finish, 6-32 coarse thread , 9.525mm long.}
Backing Plate: 304 or 416 stainless steel, 0.250"
8 _thickness.
9 ^{Dowel Pin: 1/16" dia., 18-8 stainless steel.}
6
10 ^{Dowel Pin: 3/64" dia., acetal plastic.}
2
5
11
Backing Plate Insulator: Cirlex or equivalent, 0.010"
thickness.
10
4
Customer's PCB
11
8
SG-BGA-6074 Drawing
© 2002 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Heidi Hansen
File: SG-BGA-6074 Dwg.mcd
Scale: -
Rev: A
Date: 11/27/02
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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