SG-BGA-6072 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
(Without
Heatsink)
1.875mm
6.263mm
6.638mm
2.25mm
60.5mm
30.56mm
A
40.225mmSqr.
0.375mm
60.5mm
49mmSqr.
6.5mm 30.935mm
3.5mm
GHz BGA Socket - Direct mount, solderless
Top View of Heat Sink Lid
3.5mm
0.375mm
A
53.5mm
30.56mm
A1 orientation Mark
3.5mm
Ø 5.5mm
Counter bore 3.25mm
deep (x4)
Side View at AA
3.5mm
30.185mm
53.5mm
Ø 0.8mm(x4)
R 1.27mm(x4)
4-40 Thread
Lid mounting hole (x4)
8
7
Socket base: Black anodized 6061 Aluminum.
1 Thickness = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
2 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
3
Elastomer Guide: Non-clad FR4.
Thickness = 0.75mm.
4 ^{Ball Guide: Kapton polyimide. Thickness = 0.25mm}
Socket base screw: Socket head cap, 18-8 Stainless
5 _{steel, 4-40 thread , 1/2" long.}
3.25mm
2
6mm
1.6mm
5
1
4
3
6
6
Alignment pin: Dowel pin, 18-8 Stainless steel,
1.5mm dia.
7 _{Socket Lid Screw: Alloy steel, 4-40 thread, 3/4" length}
8 ^{Heat Sink Lid}
9 ^{Backing Plate: 416 stainless steel, 4.76mm thick}
10 Insulation Plate: FR4 or Ultem 2300 3.625mm thick.
9
10
Note: Package cavity(40.225mm square) and upper cavity (49mm square) are offset by 0.375mm to the left from the centerline.
Lid mounting holes are symmetrical to the package cavity and moved 3.81mm in counterclockwise direction (see dimensions in top view).
SG-BGA-6072 Drawing
© 2002 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Heidi Hansen
File: SG-BGA-6072 Dwg.mcd
Scale: 1:1
Rev: A
Date: 11/4/02
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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