SG-BGA-6070 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

A
Top View
1
Assembled
8.25mm +
IC thickness
Side View
(Section AA)
10
6
Customer's
BGA IC
SG-BGA-6070 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
4
3
5
A
Recommended torque = 2 in lbs.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Shoulder screw, 18-8 SS, 0-80
fine thread.
9
Socket lid screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 0.64mm thickness.
Status: Released
Drawing: H. Hansen
File: SG-BGA-6070 Dwg.mcd
Scale: -
Rev: B
Date: 5/27/03
Modified: 6/12/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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