SG-BGA-6069 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
40.225mm
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
1
6
40.225mm
4
3
Customer's
5
11
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Recommended torque = 18 in lbs. ₅
9
6
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.75mm.
7 ^{Ball Guide: Kapton polyimide.}
2
8
7
8
Socket base screw: Socket head cap, 18-8 Stainless
steel, 0-80 fine thread , 19.05mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
10
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
Customer's Target PCB
SG-BGA-6069 Drawing
© 2002 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6069 Dwg.mcd
Scale: -
Rev: C
Date: 12/27/02
Modified: 5/19/08
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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