SG-BGA-6063 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
A
1
Assembled
8.25mm +
IC thickness
32.225mm
Side View
10
(Section AA)
6
Customer's
BGA IC
SG-BGA-6063 Drawing
© 2002 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
A
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Recommended torque = 3 in lbs./
48 in oz.
9
2
8
7
11
Customer's Target PCB
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Black anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Fillister head, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Status: Released
Drawing: H. Hansen
File: SG-BGA-6063 Dwg
Scale: -
Rev: E
Date: 8/29/02
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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