SG-BGA-6061 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
21.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
21.225mm
6
10
Customer's
BGA IC
SG-BGA-6061 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
4
3
12
5
Recommended torque = 1 in lbs.
9
2
8
7
11
Customer's Target PCB
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Black anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
11 ^{Nylon washer: 1.73mm ID; 4.78mm OD, 0.64mm thick}
12 ^{IC guide: Torlon}
Status: Released
Scale: NA
Rev: D
Drawing: E Smolentseva
Date: 9/13/02
File: SG-BGA-6061 Dwg.mcd
Modified: 03/31/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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