SG-BGA-6060 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
22.225mm
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
22.225mm
1
4
3
6
10
5
Customer's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 3 - 4 in lbs.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Black anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 0.64mm thickness.
SG-BGA-6060 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6060 Dwg.mcd
Scale: -
Rev: C
Date: 8/14/02
Modified: 7/6/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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