SG-BGA-6055 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
30.50mm
Side View
Assembled
8.25mm +
IC thickness
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
40.10mm
4
1
10
6
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Recommended torque = 4 - 6 in lbs.
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4 Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
9
8
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
2
7
7 Ball Guide: Kapton polyimide.
Socket base screw: Philips round head, alloy steel
8 _{with black oxide finish, 2-56 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
11
Customer's Target PCB
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
SG-BGA-6055 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6055 Dwg.mcd
Scale: 2:1
Rev: D
Date: 8/1/02
Modified: 8/3/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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