SG-BGA-6051 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
26.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
(not including
die thickness,
if present)
26.225mm
4
3
9
6
Customer's
BGA IC
5
GHz BGA Socket - Direct mount, solderless
Features
Socket supports IBM PowerPC 750FX as well as other BGA devices.
Directly mounts to target PCB (needs tooling holes) with included hardware.
High speed, reliable elastomer connection.
Minimum real estate required.
Compression plate distributes forces evenly.
Easily removable swivel socket lid.
A
Recommended torque = 5 - 7 in lbs.
8
2
7
10
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5.0mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
Socket base screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
8
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
9 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
10 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
SG-BGA-6051 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: D Megran
File: SG-BGA-6051 Dwg.mcd
Scale: N/A
Rev: C
Date: 10/29/02
Modified: 07/08/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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