SG-BGA-6046 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
40.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
A
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 6.5mm.}
40.225mm
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 24 in lbs.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
1
4
Elastomer: 40 micron dia gold plated brass
9
3
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.75mm.
2
7 ^{Ball Guide: Kapton polyimide.}
8
7
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
Customer's
5
6
11
BGA IC
Customer's Target PCB
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
SG-BGA-6046 Drawing
© 2002 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6046 Dwg.mcd
Scale: -
Rev: F
Date: 4/17/02
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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