SG-BGA-6024 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
28.225mm
A
Side View
(Section AA)
Assembled
13.25mm +
IC thickness
28.225mm
1
10
6
Customer's
BGA IC
4
3
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 3 to 7 in lbs.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Black anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
SG-BGA-6024 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6024 Dwg.mcd
Scale: NA
Rev: F
Date: 11/27/01
Modified: 7/6/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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