SG-BGA-6006 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Directly mounts to target PCB (needs tooling holes) with hardware

Top View
24.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
24.225mm
4
3
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 1 in lbs.
9
2
8
7
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
9 ^{Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine}
thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
10
6
Customer's
BGA IC
SG-BGA-6006 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
11
5
Customer's Target PCB
Status: Released
Scale: -
Rev: G
Drawing: Meghann Fedde
Date: 8/16/01
File: SG-BGA-6006 Dwg.mcd
Modified: 7/16/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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