SG-BGA-6003 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
19.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
19.225mm
4
3
A
Recommended torque = 2 in lbs.
9
2
8
7
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
6
10
5
Customer's
BGA IC
11
Customer's Target PCB
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 _{0.64mm thickness.}
M
R
1
2
SG-BGA-6003 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: G
Drawing: Meghann Fedde
Date: 8/15/01
File: SG-BGA-6003 Dwg.mcd
Modified: 6/2/09
R
All tolerances: ±0.125mm (unless stated
1
otherwise). Materials and specifications
2
are subject to change without notice.
PAGE 1 of 3
R
1