SF-BGA92D-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

1.5mm
[0.059"]
11mm [0.433"]
1mm X 45° Chamfer
2.3mm [0.091"]
0.8mm typ.
19mm
[0.748"]
Top View
Side View
4.54mm [0.179"]
1
0.8mm typ.
0.2mm [0.008"]
2
[0.014" ± 0.002"]
0.36mm ± 0.05mm
3
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10
1 or equivalent high temp material;
Non-clad
Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm
2 _{[10µ"] Au over 1.27µm [50µ"] Ni (min.).}
3 Solder Balls: Sn63Pb37
Description: Giga-snaP BGA SMT Foot
92 position solder balls (0.8mm centers, 6x17 array) to terminal pins (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA92D-B-61 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 6:1
Rev: C
Drawing: A. Evans
Date: 06/01/09
File: SF-BGA92D-B-61 Dwg.mcd
Modified: 07/01/14