SF-BGA90C-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

8.00mm [0.315"]
0.80mm [0.031"]
0.90mm
[0.035"]
13.00mm
[0.512"]
0.80mm typ.
Top View
3
1
4.55mm
[0.179"] ^1.68mm
2
[0.066"]
Side View
Ø 0.20mm [Ø 0.008"] typ.
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 _{Solder Balls: Sn96.5Ag3.0Cu0.5}
RoHS
Description: Giga-snaP smt adapter
90 position solder balls to terminal pins (0.8mm centers)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA90C-B-61F Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr Suite 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: SF-BGA90C-B-61F Dwg
Scale: 8:1
Rev: B
Date: 10/17/08
Modified: 07/01/14