SF-BGA84H-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
3.20
12.50
11.20
ISO VIEW TOP
0.80
6.40
BOTTOM VIEW
8.00
ISO VIEW BOTTOM
2
1
0.36
0.2032 typ.
2.96
4.55
Substrate: 1.59 0.18mm [0.0625" 0.007"] non clad high
1 temp material.
2
Pins:material-Brass Alloy 360 1/2 hard; finish- 0.25µm
[10µ] Au over 1.27µm [50µ"] Ni (min)
3 Solder Balls: Sn96.5Ag3.0Cu0.5
3
FRONT VIEW
Description: Giga-snaP BGA SMT ball on pin land socket for 8mm x12.5mm 84 pin 0.8mm pitch BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
Doc
Rev
Date
Initials Description
A 9/30/15 SF Original
SF-BGA84H-B-61F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.48
STATUS: Released
ENG: S. Faiz
FILE: SF-BGA84H-B-61F Dwg
SHEET: 1 OF 1
DRAWN BY: S. Faiz
DATE: 9/30/15
REV. A
SCALE: 5:1