SF-BGA821A-B-05 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

2.50
2.50
14.8625 (x8)
12.0250
0.85 (x2)
12.40
12.3225
9.7825
0.60 pad (x821)
24.80
29.7250
34.7250
0.80 typ.
2
PART NO.
SUFFIX
SOLDER BALL ALLOY
-05
-05F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
TOP VIEW
3.175
FRONT VIEW
1
ITEM
NO.
PART NUMBER
DESCRIPTION
1
Substrate
via in pad substrate for SF-05 adapter
0.8mm pitch 32x32 array 821 position
2
Threaded Insert
#0-80 internal Thread brass insert,
Press fit
3
0.39
3
Solder ball
Solder Ball, 0.024" Dia,
Sn63Pb37
Description: SF-BGA-05 smt adapter for 27mm 0.8mm pitch 32x32 array BGA821 package
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA821A-B-05 Drawing
SF-BGA821A-B-05F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 4.53
STATUS: Released
ENG: S. Faiz
FILE: SF-BGA821A-B-05 Dwg
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 12-13-2013
REV. A
SCALE: 2.5:1