SF-BGA80P-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
Orientation Mark
9.60
11.00
TOP VIEW
0.80 typ
9.60
1.94
3.53
FRONT VIEW
2
0.2032
1
0.36±0.05
3
PART NO
1
2
3
DESCRIPTION
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material;
Non-clad
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25μm [10μ"] Au over 1.27μm [50μ"] Ni (min.).
Solder Balls: Sn96.5Ag3.0Cu0.5
Description: SF-BGA-61, BGA80
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA80P-B-61F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.48
STATUS: Released
ENG: M. Tully
FILE: SF-BGA80P-B-61F Dwg
RoHS Compliant
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 04/16/2015
REV. A
SCALE: 5:1