SF-BGA784C-B-64 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
2
23.00
A1
0.80 TYP
ISO top view
23.00
1
21.60
ISO bottom view
TOP VIEW
21.60
ITEM NO.
1
2
3
DESCRIPTION
High Temp Substrate
non-clad panel SF-BGA-64 23x23mm 28x28 array
0.8mm pitch 784 BGA (Total hole count: 1568)
Solder Ball, 0.4572mm dia (See Table)
3
SIDE VIEW
2.56±0.03
0.36
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot 23x23mm 28x28 array 0.8mm pitch BGA784
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA784C-B-64 Drawing
SF-BGA784C-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 3.31
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA784C-B-64 Dwg
SHEET: 1 OF 1
SCALE: 3:1
DATE: 09/03/2015
REV. A