SF-BGA784C-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
23.00
21.60
A1
0.80
23.00
21.60
ISO BOTTOM VIEW
TOP VIEW
0.80
1.5050
1
FRONT VIEW
0.2032±0.0250
3
2
4.8938
0.3472±0.0500
ITEM
NO.
DESCRIPTION
non-clad substrate
1
23x23mm 28x28 array
0.8mm pitch BGA784
2
Terminal Pin
3 Solder Ball, 0.4572mm dia
Material
High temp Substrate
Brass 360 Half Hard-PS-2
SN96.5AG3.0CU0.5, 0.8MA
Description: Giga-snaP BGA SMT Foot 23x23mm 28x28 array 0.8mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm
[±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA784C-B-61F Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 2.94
STATUS: Released
ENG: E. Smolentseva
FILE: SF-BGA784C-B-61F Dwg
RoHS
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 02/17/2016
REV. A
SCALE: 3:1