SF-BGA783B-B-42 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Ordering Information:
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-42
Sn96.5Ag3.0Cu0.5
-42F*
*RoHS Compliant
1.00mm
29.00mm [1.142"]
1.00mm
1.33mm
[0.052"]
2.36mm
[0.093"]
Detail A
1.00mm typ.
Top View
2.87mm
[0.113"]
1
3
2
Detail A
0.51mm
[0.020"]
4
Side View
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-fi ng er
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]}
FR4/G10 or equivalent high temp material. (RoHS)
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ "] Au over 1.27µ m [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ "] Au over 1.27µ m [50µ"] Ni (min.).
4 Solder Balls: see table above.
Description: Giga-snaP BGA SMT Foot
783 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (f rom true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA783B-B-42 Drawing
Status: Released
Scale: 3:1
Rev: A
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: E Smolentseva
File: SF-BGA783B-B-42 Dwg
Date: 11/12/08
Modified: