SF-BGA768B-B-64 Datasheet, PDF (1/2 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
3
27.000
A1
2
1
0.80 TYP
27.000
24.80
TOP VIEW
SIDE VIEW
24.80
ITEM
NO.
1
2
3
DESCRIPTION
Material
0.018" dia 63sn37pb solder ball
63SN37PB alloy solder
High Density Giga-Snap
Receptacle
P-S527A, 0.8mm Giga-snaP
receptacle
Shell: Brass Alloy 360; 0.25µm [10µ”]
Au over 2.54 µm [100µ”] Ni finish
Contact: BeCu Alloy 172; 0.25µm [10µ”]
Au over 1.27 µm [50µ”] Ni finish
SEE TABLE
2.71±0.25
0.36
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot 27x27mm 0.8mm pitch BGA768
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA768B-B-64 Drawing
SF-BGA768B-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA768B-B-64 Dwg
SHEET: 1 OF 2
SCALE: 3:1
DATE: 06/10/2015
REV. A