SF-BGA68E-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

0.9mm
[0.035"]
9mm
[0.354"]
9mm [0.354"]
0.9mm [0.035"]
0.8mm typ.
Top View
7.2mm square [0.283"]
4.5mm [0.177"]
2
0.36mm[0.014"]
1
3
Side View
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10}
or equivalent high temp material; Non-clad
Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm
2 _{[10µ"] Au over 1.27µm [50µ"] Ni (min.).}
3 Solder Balls: Sn63Pb37
Description: Giga-snaP BGA SMT Foot
68 position terminal pins (0.8mm centers, 10x10 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA68E-B-61 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: B
Drawing: A. Evans
Date: 06/01/09
File: SF-BGA68E-B-61 Dwg.mcd
Modified: 09/02/2014