SF-BGA676C-B-05F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
2.50
2.50
2.3625
2.7375
1.00 typ
2.54
2
0.60 pads
34.725
5.08
TOP VIEW
FRONT VIEW
25.00
29.725
1
3.1750
0.60
0.50
3
ITEM NO.
1
2
3
Description
Material
SF-BGA676C-B-05F Substrate FR4 High temp
#0-80 internal Thread brass
insert, Press fit
Brass
Solder Ball, ROHS Compliant Sn96.5 Ag3.0
0.024" Dia
Cu0.5
Description: BGA Surface Mount adaptor 26x26 array 1.0mm Pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA676C-B-05F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Contacts: Cu Clad Au Plated
Solder Ball: Sn96.5Ag3.0Cu0.5
Finish: N/A
Weight: 5.56
Rev Date Initials Description
A 05/17/06 JD Original
B 04/10/07 JD Snapped dimensions properly
C 06/09/14
DH
VW to SW; corrected from 4
mounting holes to 8
RoHS
STATUS: Released
ENG: B. Fedde
FILE: SF-BGA676C-B-05F
SHEET: 1 OF 1
DRAWN BY: D. Hauer
DATE: 06/09/14
REV. C
SCALE: 2:1