SF-BGA63C-B-64 Datasheet, PDF (1/2 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
2
A1
9.000
0.80 TYP
1
3
11.000
8.80
TOP VIEW
7.20
ITEM NO.
1
2
3
DESCRIPTION
High Temp Substrate
High Density Giga-Snap Receptacle
Solder Ball, 0.4572mm dia (See Table)
2.56±0.25
PART NO.
SUFFIX
SOLDER BALL ALLOY
SIDE VIEW
0.36
-64 Sn63Pb37
-64F* Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA63C-B-64 Drawing
SF-BGA63C-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA063C-B-64 Dwg
SHEET: 1 OF 2
SCALE: 5:1
DATE: 05/01/2012
REV. B