SF-BGA63C-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
3.60
4.40
11.00
1
3
2
TOP VIEW
9.00
0.35±0.05
ITEM NO.
1
2
3
Description
LS-BGA63C-B-61
Substrate
Terminal Pin
Material
High Temp FR4
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25μm [10μ"] Au over 1.27μm [50μ"] Ni (min.).
Solder Ball, 0.4572mm dia
Sn96.5Ag3.0Cu0.5
3.53
FRONT VIEW
0.2032
Description: Giga-snaP BGA Foot: 63 position terminal pins
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA63C-B-61F Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.31
Doc
Rev
Date
Initials Description
A 06/24/14 DH Original
STATUS: Released
ENG: M.A. Fedde
FILE: SF-BGA63C-B-61F
SHEET: 1 OF 1
DRAWN BY: D. Hauer
DATE: 06/24/14
RoHS
REV. A
SCALE: 6:1