SF-BGA60C-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

0.9mm
[0.035"]
9mm
[0.354"]
0.8mm [0.031"]
0.8mm typ.
7.2mm
[0.283"]
Top View
6.4mm [0.252"]
8mm [0.315"]
0.2mm dia.
[0.008"]
4.55mm
[0.179"]
1
Side View
0.46mm dia.
[0.018"]
2
0.36mm ± 0.05mm
[0.014" ± 0.002"]
3
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material;}
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 ^{Solder Balls: Sn63Pb37}
Description: Giga-snaP BGA SMT Foot
60 position terminal pins (0.8mm centers, 8x10 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA60C-B-61 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 6:1
Rev: C
Drawing: M.A. Fedde
Date: 2/25/08
File: SF-BGA60C-B-61 Dwg.mcd
Modified: 07/01/14