SF-BGA56H-B-74 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
2
A1
7.70
1
3
0.75 TYP
9.00
4.50
TOP VIEW
5.25
ITEM
NO.
1
DESCRIPTION
Non-clad substrate BGA56 8x7
array 0.75mm pitch
Material
FR4 High temp
2.56±0.25
Shell: Brass Alloy 360; 0.25µm [10µ”]
2
P-S527A, 0.8mm Giga-snaP
Au over 2.54 µm [100µ”] Ni finish
receptacle
Contact: BeCu Alloy 172; 0.25µm [10µ”]
Au over 1.27 µm [50µ”] Ni finish
3
Solder Ball, 0.4572mm dia
SEE TABLE
SIDE VIEW
0.36
PART NO.
SUFFIX
SOLDER BALL ALLOY
-74
Sn63Pb37
-74F*
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot BGA56 8x7 array 0.75mm pitch 7.7mmx9mm body
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA56H-B-74 Drawing
SF-BGA56H-B-74F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA56H-B-74 Dwg
SHEET: 1 OF 1
SCALE: 8:1
DATE: 06/04/2015
REV. A