SF-BGA532B-B-64F Datasheet, PDF (1/2 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
A1
U.S. Patent No. 8,091,222 B2
1
23.00
0.80 typ
2
TOP VIEW
20.00
3
2.56±0.25
FRONT VIEW
0.3600
Description: SF-BGA532B-B-64, 23mm, 26x26 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA532B-B-64F Drawing
SF-BGA532B-B-64 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 3.09
ITEM NO.
1
2
3
DESCRIPTION
High Temp Substrate
High Density Giga-Snap Receptacle
Solder Ball, 0.4572mm dia (See Table)
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
STATUS: Released
ENG: M.A. Fedde
FILE: SF-BGA532B-B-64 Dwg
SHEET: 1 OF 2
DRAWN BY: M. Raske
DATE: 03/26/2014
REV. B
SCALE: 3:1