SF-BGA503C-B-32F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

R o H S C O M P L IA N T
Top View
1.26mm
[0.050"]
1.26mm
[0.050"]
33.00mm
[1.299"]
Patent Pending
1.27mm
0.050"
3.03mm
Side View
[0.119"]
3
1.33mm
[0.052"]
2.37mm 1
4
[0.093"]
Detail A
30.48mm
[1.200"]
2.37mm
[0.093"]
2
0.66mm
[0.026"]
Detail A
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]}
FR4/G10 or equivalent high temp material. (RoHS)
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
4 _{Solder Balls (Sn96.5Ag3.0Cu0.5)}
Description: Giga-snaP BGA SMT Foot
503 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA503C-B-32F Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr., Suite 400, Burnsville, MN 55337
Tel: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 3:1
Rev: A
Drawing: J. Glab
Date: 05/25/07
File: SF-BGA503C-B-32F Dwg
Modified: