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SF-BGA48R-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice
Top View
1mm
[0.039"]
6mm
[0.236"]
2.2mm [0.087"]
0.8mm typ.
10mm [0.394"]
0.2mm dia.
[0.008"]
5.6mm square [0.220"]
Side View
4.5mm
1
2
1.59mm
R o H S C O M P L IA N T
0.46mm
3
0.36mm ± 0.05mm
[0.014" ± 0.002"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 FR4/G10 or equivalent high temp material;
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 Solder Balls: Sn96.5Ag3.0Cu0.5
Description: Giga-snaP BGA SMT Foot
48 position terminal pins (0.8mm centers, 8x6 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA48R-B-61F Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: B
Drawing: A. Evans
Date: 05/27/09
File: SF-BGA48R-B-61F Dwg.mcd
Modified: 08/29/14