SF-BGA48N-B-64 Datasheet, PDF (1/2 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
6.00
A1
2
1
3
0.75 TYP.
8.00
5.25
TOP VIEW
3.75
ITEM
NO.
DESCRIPTION
Material
1
Substrate
High Temp FR4
2.56±0.25
Shell: Brass Alloy 360; 0.25µm [10µ”]
2
High Density Giga-Snap
Receptacle
Au over 2.54 µm [100µ”] Ni finish
Contact: BeCu Alloy 172; 0.25µm [10µ”]
Au over 1.27 µm [50µ”] Ni finish
3
Solder Ball, 0.4572mm dia
SEE TABLE
SIDE VIEW
0.36
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
Description: Giga-snaP BGA SMT Foot
*RoHS Compliant
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA48N-B-64 Drawing
SF-BGA48N-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Released
DRAWN BY: E. Smolentseva
FILE: SF-BGA048N-B-64
SHEET: 1 OF 2
SCALE: 8:1
DATE: 03/07/14
REV. A