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SF-BGA480B-B-72 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice
Top View
0.97mm
[0.038"]
0.97mm
[0.038"]
37.50mm
[1.476"]
35.56mm
[1.400"]
37.50mm 35.56mm
[1.476"] [1.400"]
1.27mm
[0.050"]
4.20mm ± 0.25mm
2
[0.165"± 0.010"]
Side View
1
3
0.66mm ± 0.1mm
[0.026"± 0.004"]
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-62
Sn96.5Ag3.0Cu0.5
-62F*
Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]
1 FR4/G10 or equivalent high temp material.
17µm [1/2 oz.] (RoHS)
Pins: shell material- Brass Alloy 360 1/2 hard;
2 finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni
(min.). Contact material- BeCu; finish 0.25µm
[10µ"] Au over 1.27µm [50µ"] Ni (min. ).
*RoHS Compliant
3 Solder balls: See table
Description: Giga-snaP BGA SMT Foot
480 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA480B-B-72 (F) Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 4:1
Rev: A
Drawing: S. Faiz
Date: 02/19/09
File: SF-BGA480B-B-72 Dwg.mcd
Modified: