SF-BGA473B-B-64 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
0.80
19.00
19.00
1
17.60
2
TOP VIEW
0.80
17.60
2.56±0.25
SIDE VIEW
ITEM
NO.
DESCRIPTION
1
Substrate
3
0.36
2
Giga-snaP receptacle
Description: Giga-snaP BGA SMT Foot
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA473B-B-64 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
3
Solder Ball
STATUS: Released
ENG: B. Schatz
FILE: SF-BGA473B-B-64 Dwg
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 10/21/2014
Material
High Temp FR4
Au/Ni Plating
63SN37PB alloy solder
REV. A
SCALE: 4:1