SF-BGA448C-B-42F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
3
23.00
2
1.00 typ.
23.00
21.00
1
TOP VIEW
1.5875
SIDE VIEW
ITEM
NO.
1
2
3
DESCRIPTION
SF-BGA448C-B-42 wafer
P-S519A, Socket Pin, 1.0mm centers
minimum, #4 clip
Solder Ball, ROHS Compliant 0.024" Dia
Material
FR4 Standard
Body - Gold Plated Brass
360, Clip - Gold plated
Beryllium Copper 172
Sn96.5 Ag3.0 Cu0.5
2.87±0.25
0.51
PART NO.
SUFFIX
-42
-42F*
SOLDER BALL ALLOY
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Female Giga-snaP BGA448 23mm 22x22 array 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA448C-B-42F Drawing
SF-BGA448C-B-42 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 2.59
STATUS: Released
ENG: S. Huang
FILE: SF-BGA448C-B-42 Dwg
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 10/07/2014
REV. A
SCALE: 3.5:1