SF-BGA364C-B-64 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
A1
17.00
0.80 typ
2
3
1
17.00
TOP VIEW
15.20
15.20
Kapton Circle
ISO VIEWS
ITEM
NO.
1
2
3
DESCRIPTION
Solder Ball, 0.4572mm dia (See Table)
High temp substrate
Female receptacle
2.87±0.03
SIDE VIEW
PART NO.
SUFFIX
SOLDER BALL ALLOY
0.34
-64
Sn63Pb37
-64F*
Sn96.5Ag3.0Cu0.5
Description: Female Giga-Snap BGA364 SMT Foot
*RoHS Compliant
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA364C-B-64 Drawing
SF-BGA364C-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 1.92
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA364C-B-64 Dwg
SHEET: 1 OF 1
SCALE: 5:1
DATE: 09/21/2015
REV. A