SF-BGA361E-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
0.8mm [0.031"]
0.8mm
[0.031"]
16mm
[0.630"]
0.8mm typ.
Side View
0.2mm dia.
[0.008"]
4.5mm
1
14.4mm square [0.567"]
16mm [0.630"]
2
1.59mm
3
0.36mm ± 0.05mm
[0.014" ± 0.002"]
R o H S C O M P L IA N T
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material;}
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 ^{Solder Balls: Sn96.5Ag3.0Cu0.5}
Description: Giga-snaP BGA SMT Foot
361 position terminal pins (0.8mm centers, 18x18 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA361E-B-61F Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 5:1
Rev: B
Drawing: A. Evans
Date: 05/28/09
File: SF-BGA361E-B-61F Dwg.mcd
Modified: 09/03/14