SF-BGA360A-B-72F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.07mm
[0.042"]
25.00mm
[0.984"]
1.07mm
[0.042"]
RoHS COMPLIANT
1.27mm
[0.050"]
25.00mm
[0.984"]
Side View
2
0.48mm ± 0.1mm
[0.019"± 0.004"]
4.04mm ± 0.25mm
[0.159"± 0.010"]
1
3
22.86mm
[0.900"]
Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
17µm [1/2 oz.] (RoHS)
Pins: shell material- Brass Alloy 360 1/2 hard;
2 _{finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni}
(min.). Contact material- BeCu; finish 0.25µm
[10µ"] Au over 1.27µm [50µ"] Ni (min. ).
3 _{Solder balls: Sn96.5 Ag3.0 Cu0.5}
Description: Giga-snaP BGA SMT Foot
360 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA360A-B-72F Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 4:1
Rev: A
Drawing: E Smolentseva
Date: 03/22/07
File: SF-BGA360A-B-72F Dwg
Modified: