SF-BGA360A-B-32 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Patent Pending
Ordering Information:
Top View
25.00mm
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-32
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
-32F*
25.00mm
1.07mm
1.33mm
1.07mm
22.86mm
1
3
3.03mm
Detail A
2.37mm
4
Side View
22.86mm
Detail A
1.27mm
22.86mm
2.37mm
2
0.66mm
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]}
FR4/G10 or equivalent high temp material. (RoHS)
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Foot
4 _{Solder Balls: See Table}
360 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA360A-B-32(F) Drawing
Status: Released
Scale: 4:1
Rev: A
© 2013 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: S. Faiz
File: SF-BGA360A-B-32 Dwg
Date: 11/13/13
Modified: