SF-BGA356C-B-64F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
0.80 typ
A1
17.00
1
2
3
TOP VIEW
15.20
FRONT VIEW
2.56±0.25
0.36
Item
No.
1
2
Description
Substrate
0.75mm Giga-snaP
Receptacle
3
Solder ball
Material
High Temp FR4
Shell: Brass Alloy 360; 0.25μm [10μ”]
Au over 2.54 μm [100μ”] Ni finish
Contact: BeCu Alloy 172; 0.25μm [10μ”]
Au over 1.27 μm [50μ”] Ni finish
Sn96.5Ag3.0Cu0.5
Description: Giga-snaP BGA SMT Foot
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA356C-B-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Approval Pending
ENG: M.A. Fedde
FILE: SF-BGA356C-B-64F Dwg
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 03/26/2014
REV. -.01
SCALE: 4:1